Solder Wire

FLUX  CORED TIN/LEAD SOLDER WIRE

The fusible metal alloy used to create a permanent bond between metal workpieces. Manufactured by using high purity metals in pure Tin and solder alloy compositions. Ideal for plating of copper conductors on printed circuit Boards to extend shelf life.
Use of virgin metals and control of metallic impurities to a minimum level in manufacturing process results in optimum performance of anodes. Control on the Tin content of anodes provides added reliability.
Available in 63/37, 60/40 solder wire and 50/50 composition in 18 SWG, 20 SWG and 22 SWG.


No Clean Solder wire:

Containing non-corrosive, rosin-free flux and most important feature of this no clean solder wire are after soldering it leaves clear. The range consists of numerous alloy/flux combinations covering every electrical/electronic soldering application available in Single Core in most solder alloys. Usually incorporating complex activator to provide minimum residue and excellent reliable joint with low spattering.


Solder Bar:

The Perfect Solder’s is a special solder bar selecting the right composition and introducing a special treatment which is given at the time of manufacturing.
In solder bars, oxides can build upon the surface of molten solder to a brownish black mass it’s called as dross. On the passage of time, the surface of bond solder becomes glossy in appearance for a longer time. It results in less dross formation on the surface that makes the perfect solder available in range 63/37.


Soldering Flux:

The Perfect Soldering flux performs many functions, the most important of which removal of oxides film, tarnished films & surface film from the metal to be soldered. Its clean surfaces for optimum wetting and solder bond formation. We have researched the flux technology and have developed various types of fluxes, which provides a good surface for soldering performances.


Solder Paste:

 

The Perfect Solder Paste used in the manufacturing electronics product for PCB to connect surface mount components to pads on the board. It is also possible to solder through-hole pin in paste components by printing solder paste in/over the holes. The paste initially adheres components in place by being sticky, it’s then heated (along with the rest of the board) melting the paste and forming a mechanical bond as well as an electrical connection. Available in 63/37 solder paste.

Solder Paste for Surface Mount Technology (SMT) Process Pack. A Perfect solder paste is essentially powder metal solder suspended in a thick medium called flux. Its act as a temporary adhesive, holding the components while soldering process melts the solder and makes a stronger physical connection.

Solder paste is thixotropic, means viscosity changes over time with applied shear force (e.g., stirring). The thixotropic index is a measured viscosity of the solder paste at rest, compared to worked paste. Depending upon the formulation of the paste, it may be very important to stir the paste before it used, to ensure that the viscosity is appropriate for the proper application and meets the SMT process criteria.